Patent · US Active

Positive photosensitive insulating resin composition, cured product thereof, and electronic component

US7332254B2 · kind B2 · utility

2Cited by

1References

16Claims

0Family size

Assignee

JSR CORPORATION · JP

Inventors

Hirofumi Sasaki · Hiroshima, JP
Atsushi Ito · Tokyo, JP
Hirofumi Goto · Yokohama, JP
Yuichi Hashiguchi · Tokyo, JP

Key dates

Filing date	Aug 18, 2006
Grant date	Feb 19, 2008
Priority date	—
Expiry date	Aug 18, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/4676
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Disclosed is a positive photosensitive insulating resin composition including: The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.