Thermoplastic molding compositions having reduced water absorption

US7332560B2 · kind B2 · utility

Assignee

• Bayer MaterialScience AG · DE

Inventors

• Helmut-Werner Heuer · Krefeld, DE
• Rolf Wehrmann · Krefeld, DE

Key dates

• Filing date: Nov 4, 2005
• Grant date: Feb 19, 2008
• Expiry date: Mar 25, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31507
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A thermoplastic molding composition comprising polycarbonate and at least one (co)polyformal is disclosed. Characterized by its low water absorption the composition is particularly suitable for producing molded articles, especially optical data carriers, such as compact disks, video disks, digital versatile disks and optical data carriers that are writable and erasable once or repeatedly.