Flip chip system with organic/inorganic hybrid underfill composition
US7332822B2 · kind B2 · utility
13Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Jan 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1579
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.