Heatsink thermal module with noise improvement
US7333332B2 · kind B2 · utility
13Cited by
16References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 14, 2005 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Oct 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multiple heatsink fins with different lengths and is combined to the fan module with its end with a special geometric shape having the function of lowering the wind drag; by lowering the wind drag, not only the heat dissipation efficiency can be increased, but the noise caused by the heatsink thermal module can also be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.