Liquid cooling system and electronic equipment using the same
US7333334B2 · kind B2 · utility
11Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Aug 11, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which joins them, are constructed as an external module, and the external module is mounted externally and fixed to a housing of the electronic equipment. Cooling liquid is circulated by the pump through the heat receiving jacket, the radiator, and the tank to achieve cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.