Circuit board having test coupon and method for evaluating the circuit board
US7333346B2 · kind B2 · utility
6Cited by
6References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2004 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Jun 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern except for an opening, through which the conductive pattern is partially exposed from the lower insulation layer; a conductor disposed on the lower insulation layer and connecting to the conductive pattern through the opening; an upper insulation layer disposed on the conductor for covering the conductor and the lower insulation layer; and a test coupon disposed on the substrate for evaluating the conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.