Method of predicting CMP removal rate for CMP process in a CMP process tool in order to determine a required polishing time
US7333875B2 · kind B2 · utility
2Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2004 |
| Grant date | Feb 19, 2008 |
| Priority date | — |
| Expiry date | Nov 19, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of predicting CMP removal rate for CMP process in a CMP process tool. The method predicts CMP removal rates for CMP processes without polishing additional control wafers. The CMP process performed by the CMP process tool can be easily transferred accordingly, such that uptime of the CMP process tool is increased. In addition, number of control wafers used and production costs are also reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.