In-mould labelling
US7335006B2 · kind B2 · utility
9Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2003 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3431
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void and a second, separate mould void; and injecting material into the first and second mould voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.