Method for securing ceramic structures and forming electrical connections on the same
US7335341B2 · kind B2 · utility
23Cited by
83References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Apr 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/3484
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A new kinetic spray process is disclosed that enables one to secure a plurality of ceramic elements together quickly without the need for glues or other adhesives. The process finds special utilization in the formation of non-thermal plasma reactors wherein the kinetic spray process can be used to simultaneously secure the ceramic elements together and to form electrical connections between like electrodes in the non-thermal plasma reactor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.