Semiconductor device and method for manufacturing the same
US7335951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2004 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Nov 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.