Configurable integrated circuit capacitor array using via mask layers
US7335966B2 · kind B2 · utility
196Cited by
24References
26Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 23, 2005 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.