Junction with stepped structures between a microstrip line and a waveguide
US7336141B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Sep 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An arrangement for a junction between a microstripline and a waveguide is provided. The arrangement includes a microstripline fitted on the upper face of a dielectric substrate, a waveguide fitted on the upper face of the substrate and has an opening on at least one end surface and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to a microstripline. One side wall of the waveguide is a metallized layer formed on the substrate. A cutout is formed in the metallized layer and into which the microstripline projects. A rear-face metallization is formed on the rear face of the substrate, and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.