Heat sink
US7336491B2 · kind B2 · utility
14Cited by
25References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2005 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 2, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/949
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.