Cold plate cooling apparatus for a rack mounted electronic module
US7336493B2 · kind B2 · utility
15Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2005 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Feb 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/76
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower surface of each module and the upper surface of the cold plate base of the rack. The mechanism for clamping a module to the rack also pulls the wedge blocks together to fill in the gap between the lower surface of the module and the upper surface of the cold plate so as to provide a complete thermal path therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.