Structured ASIC device with configurable die size and selectable embedded functions
US7337425B2 · kind B2 · utility
258Cited by
23References
48Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2004 |
| Grant date | Feb 26, 2008 |
| Priority date | — |
| Expiry date | Apr 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/907
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides for a master or universal base and base tooling which addresses the general purpose Structured ASIC requirements. Another embodiment of the present invention provides for a common set of base tooling from which the master/universal base is created as well as additional custom bases with customized selection and quantity of embedded Platform ASIC functions. Embodiments can utilize conventional Structured ASIC architecture and processing and are compatible with traditional probing and packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.