Transmitter subassembly ground return path
US7338216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transmitter subassembly ground return path comprises a coupling member having a plurality of layers. At least one of the layers includes a signal trace layer that has one or more signal traces coupling components of a transceiver substrate to components of the transmitter subassembly. At least one of the one or more signal traces can be coupled to a signal coupling capacitor. At least one of the ground plane layers can connect the body of the transmitter subassembly to one or more common mode grounding capacitors. The ground plane layers of the coupling member also shield at least some of the electromagnetic radiation that can emanate from the signal trace layer in high frequency data transmissions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.