Processing apparatus
US7338572B2 · kind B2 · utility
2Cited by
47References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Aug 12, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a processing apparatus, such as a laminator, for performing operations involving effecting adhesive bonding on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.