Perforated adhesive film and its manufacturing process
US7338696B2 · kind B2 · utility
14Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2003 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Oct 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a perforated adhesive film (16) that will be used to glue a wall on one face of a cellular structure (10) to form a sandwich panel. The adhesive film (16) comprises at least one hole and not more than three holes (18) facing each of the cells (12) of the cellular structure (10). Preferably, the holes (18) are formed by punching an unperforated adhesive film. The holes (18) enable the formation of regular glue dabs on the ends of the partitions (14) separating cells (12) in the cellular structure (10), when the adhesive film (16) is heated before the wall is glued.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.