Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel
US7338737B2 · kind B2 · utility
4Cited by
4References
24Claims
0Family size
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Key dates
| Filing date | Dec 13, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | May 2, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2024
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl group including one to five carbon atoms, an ethyl 3-ethoxy propionate, an alkyl acetate that includes an alkyl group including three to eight carbon atoms, and an alkyl lactate that includes an alkyl group including one to six carbon atoms. The composition may be used to make high-quality display panels with uniformly-coated insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.