Side-emitting LED package and manufacturing method of the same
US7338823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2006 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Jun 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.