Backlight module and a light-emitting-diode package structure therefor
US7339202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Sep 21, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0055
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-converging part and a light-scattering part, in which the light-converging part has a first axis and the light-scattering part has a second axis. In addition, the first axis of the light-converging part intersects the second axis of the light-scattering part. Furthermore, one terminal of each of the two leading legs is electrically connected to the LED chip while another terminal extends out of the packaging plastic body. Because the LED package structure can converge light and scatter light in different directions, the backlight module implementing the LED package structure has the advantage of a shorter light-mixing distance and better light utilization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.