Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
US7339454B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | May 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2061/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical (MEM) apparatus is disclosed which includes a shuttle suspended above a substrate by two or more sets of tensile-stressed beams which are operatively connected to the shuttle and which can comprise tungsten or a silicon nitride/polysilicon composite structure. Initially, the tensile stress in each set of beams is balanced. However, the tensile stress can be unbalanced by heating one or more of the sets of beams; and this can be used to move the shuttle over a distance of up to several tens of microns. The MEM apparatus can be used to form a MEM relay having relatively high contact and opening forces, and with or without a latching capability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.