Modular sensor assembly
US7339490B2 · kind B2 · utility
5Cited by
19References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Apr 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular sensor assembly for sensing conditions at a computer rack, such as environmental conditions. The sensor assembly includes an elongate flexible body, configured to attach to a computer rack, with a plurality of addressable sensors, disposed along the body and interconnected to a common connector wire. A connector wire lead is provided to interconnect the connector wire to a central system configured to receive and interpret data from the plurality of sensors relating to conditions associated with the computer rack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.