Copper termination inks containing lead free and cadmium free glasses for capacitors
US7339780B2 · kind B2 · utility
7Cited by
26References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2005 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Apr 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A reduction resistant lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications is disclosed. The invention includes a capacitor, which includes a conductive copper termination. The copper termination is made by firing an ink including a glass component, which may include ZnO, provided the amount does not exceed about 65 mole %; B2O3, provided the amount does not exceed about 61 mole %; and, SiO2, provided the amount does not exceed about 63 mole %. The molar ratio of B2O3 to SiO2 is from about 0.05 to about 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.