Electronic component and electronic device
US7339781B2 · kind B2 · utility
4Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2006 |
| Grant date | Mar 4, 2008 |
| Priority date | — |
| Expiry date | Feb 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component having an element body, and a terminal electrode disposed on the element body. The terminal electrode has a first electrode layer, a second electrode layer, and a third electrode layer. The first electrode layer is formed on an external surface of the element body and formed by baking of a conductive paste. The second electrode layer is formed by Ni plating on the first electrode layer. The third electrode layer is formed by Sn plating or Sn alloy plating on the second electrode layer. A thickness of the second electrode layer is set in a range of not less than 5 μm, and less than 8 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.