Apparatus for mechanically bonding and cutting an article
US7341084B2 · kind B2 · utility
6Cited by
29References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2007 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Feb 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bonding segment is also disposed on one of the first and second members. The apparatus is operable so that a portion of the article is mechanically bonded as the article passes through the nip and a portion of the article separate from the bonded portion is cut as the article passes through the nip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.