Tailored heat transfer layered heater system
US7342206B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2004 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Mar 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A tailored heat transfer layered heater system is provided that comprises a target part defining a room temperature periphery and a layered heater disposed around or within the target part, the layered heater comprising a substrate having a room temperature periphery that is sized such that an interference fit is formed between the layered heater and the target part either through mechanical or thermal methods. The layered heater in one form is disposed around the target part and in another form is disposed inside the target part. Additionally, heat transfer is tailored along the layered heater using other devices such as thermal spacers, insulative pads, and a transfer substrate in other forms of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.