Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
US7342789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Jun 29, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.