Heat sink with integral card guide
US7342794B1 · kind B1 · utility
3Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Feb 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least one of the fins or by the base. The recesses are configured to support the edge of the circuit card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.