Interposable heat sink for adjacent memory modules
US7342797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2007 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | May 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.