Removable modules with external I/O flexibility via an integral second-level removable slot
US7343439B2 · kind B2 · utility
74Cited by
57References
9Claims
0Family size
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Inventors
Key dates
| Filing date | Sep 13, 2005 |
| Grant date | Mar 11, 2008 |
| Priority date | — |
| Expiry date | Sep 13, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/946
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The functionality provided to electronic devices by application specific removable modules is enhanced by viewing the removable modules as first-level removable modules and providing them with at least one second-level removable slot for selectively nesting second-level removable modules having particular external I/O capabilities. The functionality provided to the electronic devices by such a first-level removable module can thus be provided in part by the application specific circuitry within the removable module and further in part by the type of external I/O of the second-level removable module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.