Method of constructing a structural circuit
US7343675B2 · kind B2 · utility
14Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.