Stamping system for manufacturing high tolerance parts
US7343770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Dec 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.