Heat sink
US7343962B2 · kind B2 · utility
13Cited by
23References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 16, 2006 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | May 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.