Hermetically sealed package and method of fabricating of a hermetically sealed package
US7344901B2 · kind B2 · utility
35Cited by
46References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Jan 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and apparatus for forming a hermetic seal between two substrates includes providing an electromagnetic absorbent sealing material perimetrically about a surface of one of the substrates. Furthermore, the illustrative method includes heating the sealing material. In addition, a package having a hermetic seal and apparati for disposing a sealing material are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.