Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
US7345102B2 · kind B2 · utility
1Cited by
6References
6Claims
0Family size
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Key dates
| Filing date | Oct 15, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.