Composite overlay compound
US7345255B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2005 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Sep 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a composite overlay compound on a substrate includes forming a mixture including at least one component from a first group of component materials including titanium, chrome, tungsten, vanadium, niobium, and molybdenum. The mixture also includes at least one component from a second group of component materials including carbon and boron, and the mixture further includes at least one component from a third group of component materials including silicon, nickel, and manganese. The mixture of selected component materials is then applied to a substrate material to form an overlay compound on the substrate material. The overlay compound is fused to the substrate to form a metallurgical bond between the substrate material and the overlay compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.