Integrated circuit package with chip-side signal connections
US7345359B2 · kind B2 · utility
9Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Apr 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.