Method and apparatus for characterizing microelectromechanical devices on wafers
US7345806B2 · kind B2 · utility
5Cited by
19References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Mar 19, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.