Heat sink module
US7345880B2 · kind B2 · utility
13Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 10, 2006 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Aug 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.