Heat spreader with multiple stacked printed circuit boards
US7345885B2 · kind B2 · utility
25Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Dec 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.