Method for fabricating microelectromechanical system (MEMS) devices
US7346981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2003 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Sep 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.