Method and apparatus for cooling flasked instrument assemblies
US7347267B2 · kind B2 · utility
8Cited by
18References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2004 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Oct 20, 2025 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/017
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Method and apparatus are provided to accelerate the cooling of thermally sensitive components in a chamber of a downhole instrument assembly. In accordance with the invention, a passage is formed in the chamber and a fluid is conveyed through the passage to cool the components to the desired temperature. By using the method and apparatus of the present invention the amount of time to cool the components is dramatically less than the time required for cooling using conventional techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.