Head assembly, disk unit, and bonding method and apparatus
US7347347B2 · kind B2 · utility
9Cited by
18References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2004 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | May 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.