Mold and molding apparatus using the same
US7347683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Feb 5, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/034
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first support member, for supporting the workpiece. A pressing mechanism brings the first and second support members close to each other and presses the mold and the workpiece together so as to transfer, to the workpiece, the pattern on the mold. Recessed portions are provided on at least one of a surface of the mold on the first support member side, a region of the first support member, and a region of the second support member. The recessed portions correspond to recesses in the pattern of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.