Rigid flexible printed circuit board and method of fabricating same
US7347950B2 · kind B2 · utility
8Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Jul 19, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.