Controlled depth etched dielectric film
US7348045B2 · kind B2 · utility
10Cited by
10References
4Claims
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Key dates
| Filing date | Sep 5, 2002 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Nov 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 μm to about 60 μm including at least one thinned, recessed region wherein the thickness is reduced to less than 15 μm, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.