Hermetic packaging
US7348203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2003 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | May 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of hermetically packaging an electronic device (8), in an enclosure (2) comprising mutually inter-engageable first and second housing members (4, 6), comprising the steps of securing the electronic device (8) to the first housing member (4), engaging the first (4) and second (6) housing members such that an hermetic seal is provided there between, wherein the engagement step is performed in a controlled atmosphere. The hermetic seal may be provided by an interference fit between the first (4) and second (6) housing members or via sealing means (16) interposed between the housing members (4, 6). The second housing member (6) may comprise an optical element (20), for example a window or lens. The packaging method is particularly applicable to packaging thermal detectors, for example microbolometer arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.