Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
US7348269B2 · kind B2 · utility
9Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Mar 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The method includes placing the resin material on a substrate on which an electrode terminal is formed by an inkjet method, and forming an interconnecting metal that connects the electrode terminal to a top surface of the resin material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.