Polyimide compositions having resistance to water sorption, and methods relating thereto
US7348373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2004 |
| Grant date | Mar 25, 2008 |
| Priority date | — |
| Expiry date | Jan 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.